The life-span of a LED-light source depends strongly on an effective thermal management. The LED-industry has so far developed a broad range of different heat sink-systems and –materials. In many cases these developments have not only been based on the intention to increase the efficiency of heat dissipation. Considerations like material cost saving, safety concerns and aesthetic questions have also played an important role.
 
Proper heat dissipation and product safety are both in the center of our attention when it comes to the arrangement of an efficient thermal management. It is indispensable not only to focus on the externally visible heat sink design, but also on a proper thermal management within the lamp.
 

 
Parameters like the LED junction temperature, metal slug temperature, soldering point temperature and board temperature are in many aspects of higher importance than the  temperature of the external heat sink or ambient. We take care that the corresponding temperatures do not exceed acceptable limits. To ensure this, FecosLED applies material such as ceramic plate chips, sophisticated PCBs, COB and other high-grade dissipators. The selection of proper material in combination with sophisticated lamp design will lead to favorable values of dissipation, radiation and convection, hence efficient thermal management.
 
The current situation in the LED-industry is characterized by the ongoing development of LEDs with ever increased heat-resistance. This will allow the operation of LEDs with higher currents and increased luminous flux in future. Please contact us for further information.