From the first generation of PPA to ceramic substrate, LED packaging has undergone a constant technical upgrading. Now the third generation of EMC package is entering the markets. The emerging of this new technology promises new business opportunities to LED companies and will change the market structure profoundly.
 
EMC (Epoxy Molding Compound) is one of the main raw materials during producing IC (Integrated Circuit). With the development of IC packaging technology, EMC as the main electronic packaging materials has also been developed rapidly. Because of high reliability, low cost, simple production process, suitable for mass production, EMC occupies more than 97 % of the market share in the entire microelectronics packaging materials market. Now, EMC is extending to semiconductor devices, integrated circuits, consumer electronics, automotive, military, aviation etc.. EMC provides an excellent solution for LED packaging applications as it has excellent heat resistance and is suitable for large-scale production.


EMC package is a highly integrated framework that adopts modified epoxy materials and etching technique, the etched copper substrate makes epoxy with greater contact area with copper holder. Respect to thermoplastic PPA (High Performance Polyamide), EMC has stronger adhesive force. Moreover, EMC products are resistant against moisture and red ink penetration.
 
Although EMC package originates from the IC, it is not exactly the same. Due to the changes in materials and structures, EMC products impress with high heat resistance, anti-UV, high current resistance and small size. Particularly the UV resistance has been improved significantly. EMC products can also be applied to harsh environments as outdoor lamps and automotive lighting and will have a significant impact in the field of high-end ceramic packages.
 
In order to become more cost-efficient, the use of ultra-current in the LED industry has become widespread. However, there are also high risks on the heat treatment. The newly developed EMC-technology with its outstanding heat-resistance offers an solution. EMC technology will certainly have a deep impact on the market and particularly challenge the traditional PPA and ceramic bracket technology.sm.