Flip-Chip-Technology, firstly introduced by IBM in 1964, is increasingly gaining importance within the LED industry.
Flip-chip-technology is a process of contacting LED semiconductor-chips without housing through so-called solder bumps. Flip-chip mounting is taking place by directly mounting the chip onto the circuitry without any wiring. As a result the chip housing remains small and the circuit length short.
 
Contrary to conventional LED packaging with housing and phosphor layer, the wire- and housing-free flip-chip packages reduce size to chip-scale and therefore enable the creation of much more compact lighting fixtures as particularly smaller PCB-boards can be applied.
An additional advantage is the ability of flip-chips to be driven at a much higher current than traditional LED packages whilst having low thermal resistance which results in the maintenance of a stable luminous flux of the lighting fixtures. Flip-chip technology comes therefore typically in middle- and high-power packages and is ideally applied as for lighting fixtures which need to be small of size whilst simultaneously having a high luminous flux.
Contrary to traditional LEDs, flip chips are attached with a cell film which guarantees a uniform thickness of the layer. This leads to a lower colour deviation and high colour consistency on a high level of SDCM 3.
Reputable manufactures such as Samsung Technologies have lately released innovative flip-chip based LED indoor lighting fixtures. The recent developments indicate a distinctively increased importance of flip-chips for the entire LED-industry.sm.